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SK Hynix Business Model Canvas

SK Hynix Inc. Semiconductors

Key Partnerships

  • SK Group (parent company – strategic alignment & resources)
  • NVIDIA (HBM primary supplier partnership for AI GPUs)
  • ASML (EUV lithography equipment supply)
  • Equipment & material suppliers (Applied Materials, Tokyo Electron)
  • Cloud hyperscalers (AWS, Google, Microsoft – co-development)
  • Solidigm (Intel NAND acquisition – SSD subsidiary)
  • Automotive chip integrators

Key Activities

  • DRAM R&D & manufacturing (DDR5, LPDDR5X, HBM3E)
  • NAND flash production (238-layer & beyond)
  • HBM advanced packaging (TSV stacking technology)
  • Fab construction & yield optimization
  • Solidigm SSD development & sales
  • Memory technology roadmap development
  • AI & data-center optimized product development

Key Resources

  • Icheon & Cheongju semiconductor fabs (Korea)
  • HBM technology IP & advanced packaging capability
  • 30,000+ employees (engineers, technicians)
  • $10B+ annual capital expenditure capacity
  • Solidigm (consumer & enterprise SSD brand)
  • Memory technology patent portfolio
  • SK Group financial backing & ecosystem

Value Propositions

  • HBM leadership (primary supplier for NVIDIA AI GPUs)
  • Cutting-edge DRAM technology (DDR5, LPDDR5X – lowest power)
  • Advanced NAND flash (238-layer, highest density)
  • AI-optimized memory solutions for data centers
  • Comprehensive memory portfolio (DRAM + NAND + SSD)
  • Technology co-development partnerships with key customers
  • Reliable high-volume manufacturing capability

Customer Relationships

  • Technology co-development (HBM roadmap with NVIDIA)
  • Long-term supply agreements with hyperscalers & OEMs
  • Customer qualification & certification programs
  • Dedicated engineering support for key accounts
  • Joint development of next-gen memory standards
  • Investor relations & technology roadmap transparency
  • Solidigm consumer brand engagement

Channels

  • Direct sales to OEMs & cloud hyperscalers
  • Global sales offices (US, Europe, China, Japan, Taiwan)
  • Distribution partners for commercial/consumer NAND
  • Solidigm consumer SSD retail channels
  • Industry standards bodies (JEDEC)
  • Technology conferences & events
  • Online product catalog & technical documentation

Customer Segments

  • AI/GPU companies (NVIDIA – HBM primary customer)
  • Cloud hyperscalers (AWS, Google Cloud, Microsoft Azure)
  • Smartphone OEMs (Apple, Samsung, Xiaomi)
  • PC & laptop OEMs (Dell, HP, Lenovo)
  • Enterprise server & storage manufacturers
  • Automotive chip integrators (ADAS, infotainment)
  • Consumer SSD buyers (Solidigm brand)

Cost Structure

  • Fab construction & equipment (largest cost – $10B+ annual capex)
  • Raw materials (silicon wafers, chemicals, gases)
  • R&D investment (memory technology, advanced packaging)
  • Employee compensation (30,000+ engineers & staff)
  • Electricity & fab operating costs
  • Solidigm operations & SSD R&D
  • Depreciation on fab equipment

Revenue Streams

  • DRAM sales (60%+ of revenue – including HBM premium)
  • NAND flash sales
  • Solidigm SSD product revenue
  • HBM premium pricing (highest ASP memory product)
  • Foundry & packaging services
  • Technology licensing & IP revenue
  • Enterprise SSD & storage solutions

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SK Hynix Business Model Canvas: Complete BMC Analysis

The SK Hynix Business Model Canvas reveals how the world's second-largest memory semiconductor manufacturer dominates the AI-critical HBM (High Bandwidth Memory) market. This BMC framework analysis covers SK Hynix's nine building blocks.

Value Propositions in SK Hynix's BMC

SK Hynix's Value Propositions include HBM leadership (sole qualified supplier for NVIDIA's AI GPUs), cutting-edge DRAM technology (DDR5, LPDDR5X), advanced NAND flash (238-layer), and AI-optimized memory solutions. As a key SK Group subsidiary, SK Hynix's AI memory leadership positions it at the heart of the AI revolution, supplying chips that power models from NVIDIA and cloud providers.

Customer Segments Analysis

SK Hynix's Customer Segments include AI/GPU companies (NVIDIA), cloud hyperscalers (AWS, Google, Microsoft), smartphone OEMs (Apple, Samsung), PC OEMs, enterprise server makers, and automotive chip integrators. This B2B customer base parallels the technology supply chain role in the Huawei Business Model Canvas and LG Electronics Business Model Canvas.

Key Partners and Key Resources

The Key Partners include SK Group (parent company), NVIDIA (HBM partnership), ASML (EUV lithography), equipment & material suppliers, and foundry partners. Key Resources encompass Icheon & Cheongju fabs, HBM technology IP, advanced packaging capability (TSV), 30,000+ employees, and $10B+ annual capex. This semiconductor-scale investment mirrors the fab intensity discussed in the Samsung Business Model Canvas semiconductor division.

Revenue Streams and Cost Structure

SK Hynix's Revenue Streams flow from DRAM sales (60%+, including HBM), NAND flash sales, Solidigm SSD products, and foundry/packaging services. The Cost Structure includes fab construction & equipment ($10B+ annual capex), raw materials (silicon wafers, chemicals), R&D (memory technology, packaging), and employee costs. Compare this capex-intensive model to the POSCO Business Model Canvas heavy-industry investment cycles.

Channels and Customer Relationships

SK Hynix's Channels include direct sales to OEMs & hyperscalers, distribution partners, Solidigm consumer SSD channels, and global sales offices. Customer Relationships leverage technology co-development (HBM with NVIDIA), long-term supply agreements, qualification programs, and dedicated engineering support. This deep B2B partnership model mirrors the LG Chem Business Model Canvas battery qualification approach.

Key Activities in the BMC Framework

SK Hynix's Key Activities include DRAM R&D & manufacturing (DDR5, HBM), NAND flash production (238-layer), advanced packaging (HBM TSV stacking), fab construction & yield optimization, and Solidigm SSD development. These semiconductor activities parallel the chip design efforts in the Huawei Business Model Canvas Kirin/Ascend programs.

Comparing Semiconductor Business Model Canvases

Study related BMC analyses: the Samsung BMC for memory rival, SK Group BMC for parent conglomerate, NVIDIA BMC for AI GPU customer, Huawei BMC for chip design comparison, and LG Electronics BMC for Korean tech ecosystem. Each Business Model Canvas shows different semiconductor value chain positions.

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